PCBA外观检验标准2046787737.pdf
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1、理想狀況(Target Condition)SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMD Assembly workmanship criteria-Chip component alignment(X Axis)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出,所有各金屬封頭都能完全與焊墊接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.1.零件橫向超出焊墊以外,但允收狀況(Accept Condit
2、ion)註:此標準適用於三面或五面之晶片狀零件This standard only be used for 3 or 5 face terminations chip componentww330拒收狀況(Reject Condition)1.零件橫向超出焊墊以外,但尚未大於其零件寬度的50%。(X1/2W)1.The component shifted off the pad and shift length shall less 1/2 chip width1.零件已橫向超出焊墊,大於零件寬度的50%(MI)。(X1/2W)1.The component shifted off the p
3、ad and shift length over 1/2 chip withX1/2WX1/2WX1/2W X1/2W理想狀況(Target Condition)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出,所有各金屬封頭都能完全與焊墊接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.1.零件縱向偏移,但焊墊尚保有其零件寬度的25%以上。(Y1 1/4W)允收狀況(Accept Condition)W W 330SMT零件組裝工
4、藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMD Assembly workmanship criteria-Chip component alignment(Y Axis)拒收狀況(Reject Condition)(Y1 1/4W)2.零件縱向偏移,但零件端電極仍蓋住焊墊為其零件寬度的25%以上。(Y2 1/4W)Component is shifted towards longest part of the chip,but the termiuad end of chip still on the land1.The Pad length not be cover by ch
5、ip(Y1)shall over 1/4 chip width(W)2.1/4 width of the land for solder fillet to form.1.零件縱向偏移,但焊墊未保有其零件寬度的25%(MI)。(Y11/4W)2.零件縱向偏移,但零件端電極蓋住焊墊小於其零件寬度的25%。(Y21/4W)3.Whichever is rejected.Y2 1/4WY1 1/4WY2 1/4WY1 1/4W理想狀況(Target Condition)SMT零件組裝工藝標準-圓筒形(Cylinder)零件之對準度SMD Assembly workmanship criteria-C
6、ylinder component alignment1.組件的接觸點在焊墊中心1.The point of contact is centered on the lands1.組件端寬(短邊)突出焊墊端允收狀況(Accept Condition)註:為明瞭起見,焊點上的錫已省去。Note:In order to clarify the figure,the solder joint be eliminatedD拒收狀況(Reject Condition)部份是組件端直徑33%以下。(X 1/3D)2.零件縱向偏移,但金屬封頭仍在焊墊上。(Y10 mil),(Y20 mil)1.The len
7、gth of component shifted off the pad(X)shall less the 1/3 Diameter of component2.Shifted toward the longest part of the component,the solder terminations still on the land1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以上(MI)。(X1/3D)2.零件縱向偏移,但金屬封頭未在焊墊上。(Y10 mil),(Y20 mil)3.Whichever is rejected.X1/3D1/3DX1/3D1/3DY20milY1
8、0 0milX1/3D1/3DX1/3D1/3DY20 0 milY10 0 mil理想狀況(Target Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度SMD Assembly workmanship criteria-Gull-Wing footprint alignment1.各接腳都能座落在各焊墊的中央,而未發生偏滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑,所偏出焊墊以外的接腳,尚未超過接腳本身寬度的1/2W。(X1/2W)允收狀況(Accept Condition
9、)WS 拒收狀況(Reject Condition)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil)1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead2.The clearance(S)between lead shifted off and land shall over 5 milXX1/2W S S5mil5milX1/2W S S5mil5mil1.各接腳已發生偏滑,所偏出焊墊以外的接腳,已超過接腳本身寬度的1/2W(M
10、I)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil)3.Whichever is rejected.理想狀況(Target Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMD Assembly workmanship criteria-Gull-Wing toe alingnment1.各接腳都能座落在各焊墊的中央,而未發生偏滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑,所偏允收狀況(Accept Condition)W
11、 W 拒收狀況(Reject Condition)1.各接腳已發生偏滑,所偏出焊墊以外的接腳,尚未超過焊墊側端外緣。1.The lead had shifted and footprint not over the end of land1.各接腳側端外緣,已超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI)已超過焊墊側端外緣已超過焊墊側端外緣理想狀況(Target Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度SMD Assembly workma
12、nship criteria-Gull-Wing heel alingnment1.各接腳都能座落在各焊墊的中央,而未發生偏滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑,腳跟允收狀況(Accept Condition)TX X拒收狀況(Reject Condition)1.各接腳已發生偏滑,腳跟剩餘焊墊的寬度,最少保有一個接腳厚度(XT)。1.The lead had shifted the length from lead heel to end of land(X)shall be over the thick
13、ness of land(T)1.各接腳己發生偏滑,腳跟剩餘焊墊的寬度,已小於接腳厚度(XT)(MI)。TX TTTXT理想狀況(Target Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMD solder joint workmanship criteria-Minimum solder of Gull Wing footprint1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fi
14、llet between land and lead3.the shape(profile)of lead be clearly visible1.引線腳的底邊與板子焊墊間的允收狀況(Accept Condition)拒收狀況(Reject Condition)1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角需90度。1.Width of solder fillet between lead and land(X)shall over 2/3 lead footprint(L
15、)2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle 90on heel1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。2.腳跟(Heel)焊錫帶涵蓋高度 h小於零件腳1/2厚度。(h=2/3LLX2/3Lh1/2TTh1/2TT理想狀況(Target Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMD solder joint workmanship criteria-Maximum solder of Gu
16、ll Wing footprint1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。允收狀況(Accept Condition)接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Good s
17、older flow up and concave fillet between land and lead2.Concave solder fillet between side face of lead and land3.The shape(profile)of lead(footprint)be clearly visible1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whichever is rejected.1.solder flow cover the end(TIP)of lead2.The shape(profile)of lead not b
18、e visible clearly3.Whichever is rejected拒收狀況(Reject Condition)理想狀況(Target Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMD solder joint workmanship criteria-Minimum solder of Gull Wing Heel1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註:引線上彎頂部:引線上彎底部:引線下彎頂部:引線下彎底部1.Solder flow up to the center between B,C point
19、 on the heel of lead允收狀況(Accept Condition)ABDC拒收狀況(Reject Condition)1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder flow up to B point on the heel1.腳跟的焊錫帶延伸到引線上彎曲處的底部(B),延伸過高,且沾錫角超過90度,才拒收(MI)。1.Solder flow up over(cross)B point and the wetting angle over 90 degree沾錫角超過沾錫角超過90度度理想狀況(Target Condition)SMT焊點性工藝標準-J型
20、接腳零件之焊點最小量SMD solder joint workmanship criteria-Minimum solder of J type lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at
21、 every solder contact允收狀況(Accept Condition)AT B拒收狀況(Reject Condition)1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up on the lead angle(h)shall over 1/2 angle height(T)1.焊錫帶存在於引線的三側以下(MI)。2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h1/2T)(MI)。3.Whichever is r
22、ejected.1.Solder concave fillet is less 3 face2.Height of solder flow-up on the lead angle(h)under 1/2 angle height(T)3.Whichever is rejectedh1/2Th 1/2T理想狀況(Target Condition)SMT零件組裝工藝標準-J型腳零件對準度SMD Assembly workmanship criteria-J type lead alignment1.各接腳都能座落在焊墊的中央,未發生偏滑。1.All the leads footprint is
23、centered on the lands允收狀況(Accept Condition)SW1.各接腳已發生偏滑,所偏出焊墊以外的接腳,尚未超過接腳本身寬度的1/2W拒收狀況(Reject Condition)S5mil5milX1/2W S1/2W 1.各接腳已發生偏滑,所偏出焊墊以外的接腳,已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whichever is rejected.超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5
24、mil)The lead had shifted off the land1.The length of lead shifted off the land(X)shall less 1/2 width of lead(W)2.The clearance distance between shifted lead and land edge shall over 5 mil理想狀況(Target Condition)SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMD solder joint workmanship criteria-Maximum solder of J type
25、 lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact1.凹面焊錫帶延伸到引線彎允收狀況(Accept Condition)AB 拒收狀況(Reject C
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